![]() |
|
If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
Datasheet File OCR Text: |
1 data sheet acquired from harris semiconductor schs142f september 1997 - revised october 2003 features overriding reset terminates output pulse triggering from the leading or trailing edge q and q buffered outputs separate resets wide range of output-pulse widths schmitt trigger on both a and b inputs fanout (over temperature range) - standard outputs . . . . . . . . . . . . . . . 10 lsttl loads - bus driver outputs . . . . . . . . . . . . . 15 lsttl loads wide operating temperature range . . . -55 o c to 125 o c balanced propagation delay and transition times signi?ant power reduction compared to lsttl logic ics hc types - 2v to 6v operation - high noise immunity: n il = 30%, n ih = 30%of v cc at v cc = 5v hct types - 4.5v to 5.5v operation - direct lsttl input logic compatibility, v il = 0.8v (max), v ih = 2v (min) - cmos input compatibility, i l 1 a at v ol , v oh description the ?c123, ?ct123, cd74hc423 and cd74hct423 are dual monostable multivibrators with resets. they are all retriggerable and differ only in that the 123 types can be triggered by a negative to positive reset pulse; whereas the 423 types do not have this feature. an external resistor (r x ) and an external capacitor (c x ) control the timing and the accuracy for the circuit. adjustment of rx and c x provides a wide range of output pulse widths from the q and q terminals. pulse triggering on the a and b inputs occur at a particular voltage level and is not related to the rise and fall times of the trigger pulses. once triggered, the output pulse width may be extended by retriggering inputs a and b. the output pulse can be terminated by a low level on the reset (r) pin. trailing edge triggering ( a) and leading edge triggering (b) inputs are provided for triggering from either edge of the input pulse. if either mono is not used each input on the unused device ( a, b, and r) must be terminated high or low. the minimum value of external resistance, rx is typically 5k ? . the minimum value external capacitance, cx, is 0pf. the calculation for the pulse width is t w = 0.45 r x c x at v cc = 5v. ordering information part number temp. range ( o c) package cd54hc123f3a -55 to 125 16 ld cerdip cd54hct123f3a -55 to 125 16 ld cerdip cd74hc123e -55 to 125 16 ld pdip cd74hc123m -55 to 125 16 ld soic cd74hc123mt -55 to 125 16 ld soic cd74hc123m96 -55 to 125 16 ld soic cd74hc123nsr -55 to 125 16 ld sop cd74hc123pw -55 to 125 16 ld tssop cd74hc123pwr -55 to 125 16 ld tssop cd74hc123pwt -55 to 125 16 ld tssop cd74hc423e -55 to 125 16 ld pdip cd74hc423m -55 to 125 16 ld soic cd74hc423mt -55 to 125 16 ld soic cd74hc423m96 -55 to 125 16 ld soic cd74hc423nsr -55 to 125 16 ld sop cd74hct123e -55 to 125 16 ld pdip cd74hct123m -55 to 125 16 ld soic cd74hct123mt -55 to 125 16 ld soic cd74hct123m96 -55 to 125 16 ld soic cd74hct423e -55 to 125 16 ld pdip cd74hct423mt -55 to 125 16 ld soic cd74hct423m96 -55 to 125 16 ld soic note: when ordering, use the entire part number. the suf?es 96 and r denote tape and reel. the suf? t denotes a small-quantity reel of 250. caution: these devices are sensitive to electrostatic discharge. users should follow proper ic handling procedures. copyright 2003, texas instruments incorporated cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 high-speed cmos logic dual retriggerable monostable multivibrators with resets [ /title ( cd74 h c123 , c d74 h ct12 3 , c d74 h c423 , c d74 h ct42 3 ) / sub- j ect ( high s peed
2 pinout cd54hc123, cd54hct123 (cerdip) cd74hc123 (pdip, soic, sop, tssop) cd74hc423 (pdip, soic, sop) cd74hct123, cd74hct423 (pdip, soic) top view functional diagram 14 15 16 9 13 12 11 10 1 2 3 4 5 7 6 8 1a 1b 1r 1q 2q 2c x gnd 2r x c x v cc 1c x 1q 2q 2r 2b 2a 1r x c x 2r 11 2a 9 10 5 12 2q 2q 2b mono 2 v cc 67 2cx 2rxcx 1r 3 1a 2 1 13 4 1q 1q 1b mono 1 v cc 14 15 1cx 1rxcx 1cx 1rx 2cx 2rx truth table inputs outputs ab rq q cd74hc/hct123 hxhlh xlhlh l h hh xxllh lh cd74hc/hct423 hxhlh xlhlh l h hh xxllh h = high voltage level, l = low voltage level, x = don? care. cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 3 absolute maximum ratings thermal information dc supply voltage, v cc . . . . . . . . . . . . . . . . . . . . . . . . -0.5v to 7v dc input diode current, i ik for v i < -0.5v or v i > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . . . 20ma dc output diode current, i ok for v o < -0.5v or v o > v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 20ma dc output source or sink current per output pin, i o for v o > -0.5v or v o < v cc + 0.5v . . . . . . . . . . . . . . . . . . . . 25ma dc v cc or ground current, i cc or i gnd . . . . . . . . . . . . . . . . . . 50ma operating conditions temperature range (t a ) . . . . . . . . . . . . . . . . . . . . . -55 o c to 125 o c supply voltage range, v cc hc types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2v to 6v hct types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5v to 5.5v dc input or output voltage, v i , v o . . . . . . . . . . . . . . . . . 0v to v cc input rise and fall time 2v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (max) 4.5v. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (max) 6v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (max) package thermal impedance, ja (see note 1): e (pdip) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 o c/w m (soic) package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 o c/w ns (sop) package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 o c/w pw (tssop) package . . . . . . . . . . . . . . . . . . . . . . . . . 108 o c/w maximum junction temperature . . . . . . . . . . . . . . . . . . . . . . . 150 o c maximum storage temperature range . . . . . . . . . .-65 o c to 150 o c maximum lead temperature (soldering 10s) . . . . . . . . . . . . . 300 o c (soic - lead tips only) caution: stresses above those listed in ?bsolute maximum ratings may cause permanent damage to the device. this is a stress only rating and operatio n of the device at these or any other conditions above those indicated in the operational sections of this speci?ation is not im plied. note: 1. the package thermal impedance is calculated in accordance with jesd 51-7. dc electrical speci?ations parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min typ max min max min max hc types high level input voltage v ih - - 2 1.5 - - 1.5 - 1.5 - v 4.5 3.15 - - 3.15 - 3.15 - v 6 4.2 - - 4.2 - 4.2 - v low level input voltage v il - - 2 - - 0.5 - 0.5 - 0.5 v 4.5 - - 1.35 - 1.35 - 1.35 v 6 - - 1.8 - 1.8 - 1.8 v high level output voltage cmos loads v oh v ih or v il -0.02 2 1.9 - - 1.9 - 1.9 - v -0.02 4.5 4.4 - - 4.4 - 4.4 - v -0.02 6 5.9 - - 5.9 - 5.9 - v high level output voltage ttl loads - - --- - - - - v -4 4.5 3.98 - - 3.84 - 3.7 - v -5.2 6 5.48 - - 5.34 - 5.2 - v low level output voltage cmos loads v ol v ih or v il 0.02 2 - - 0.1 - 0.1 - 0.1 v 0.02 4.5 - - 0.1 - 0.1 - 0.1 v 0.02 6 - - 0.1 - 0.1 - 0.1 v low level output voltage ttl loads - - --- - - - - v 4 4.5 - - 0.26 - 0.33 - 0.4 v 5.2 6 - - 0.26 - 0.33 - 0.4 v input leakage current i i v cc or gnd -6-- 0.1 - 1- 1 a quiescent device current i cc v cc or gnd 0 6 - - 8 - 80 - 160 a cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 4 hct types high level input voltage v ih - - 4.5 to 5.5 2- - 2 - 2 - v low level input voltage v il - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 v high level output voltage cmos loads v oh v ih or v il -0.02 4.5 4.4 - - 4.4 - 4.4 - v high level output voltage ttl loads -4 4.5 3.98 - - 3.84 - 3.7 - v low level output voltage cmos loads v ol v ih or v il 0.02 4.5 - - 0.1 - 0.1 - 0.1 v low level output voltage ttl loads 4 4.5 - - 0.26 - 0.33 - 0.4 v input leakage current i i v cc and gnd 0 5.5 - 0.1 - 1- 1 a quiescent device current i cc v cc or gnd 0 5.5 - - 8 - 80 - 160 a additional quiescent device current per input pin: 1 unit load ? i cc (note 2) v cc -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 a note: 2. for dual-supply systems theoretical worst case (v i = 2.4v, v cc = 5.5v) specification is 1.8ma. dc electrical speci?ations (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units v i (v) i o (ma) min typ max min max min max hct input loading table input unit loads all 0.35 note: unit load is ? i cc limit speci?d in dc electrical table, e.g. 360 a max at 25 o c. prerequisite for switching speci?ations parameter symbol v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max min typ max hc types minimum input, pulse width t wl a 2 100 - - 125 - - 150 - - ns 4.5 20 - - 25 - - 30 - - ns 617- -21- -26- -ns bt wh 2 100 - - 125 - - 150 - - ns 4.5 20 - - 25 - - 30 - - ns 617- -21- -26- -ns cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 5 rt wl 2 100 - - 125 - - 150 - 150 ns 4.5 20 - - 25 - - 30 - 30 ns 6 17 - - 21 - - 26 - 26 ns a and b hold time t h 2 50 - - 65 - - 75 - 75 ns 4.5 10 - - 13 - - 15 - 15 ns 6 9 - - 11 - - 13 - 13 ns reset removal time t rem 2 50 - - 65 - - 75 - 75 ns 4.5 10 - - 13 - - 15 - 15 ns 6 9 - - 11 - - 13 - 13 ns retrigger time number t rt 5---------ns r x = 10k ? , c x = 0 - 50 - - 63 - - 76 - ns output pulse width t w 5 q or q r x = 10k ? ,c x = 10nf 40 - 50 38.7 - 51.3 38.2 - 51.8 s hct types minimum input, pulse width t wl 5 - a20--25--30--ns bt wh 20 - - 25 - - 30 - - ns rt wl 20 - - 25 - - 30 - - ns a and b hold time t h 510- -13- -15- -ns reset removal time t rem 510- -13- -15 -ns retrigger time number (note 3) r x = 10k ? , c x = 0 t rt 5 - 50 - - 63 - - 76 - ns output pulse width q or q t w 5 40 - 50 38.7 - 51.3 38.2 - 51.8 s r x = 10k ? ,c x = 10nf note: 3. time to trigger depends on the values of r x and c x . the output pulse width can only be extended when the time between the active- going edges of the trigger input pulses meet the minimum retrigger time requirement. prerequisite for switching speci?ations (continued) parameter symbol v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c units min typ max min typ max min typ max cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 6 switching speci?ations input t r , t f = 6ns, r x = 10k ? , c x = 0 parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c unit s min typ max min max min max hc types trigger propagation delay t plh c l = 50pf a, b, r to q 2 - - 300 - 375 - 450 ns 4.5 - - 60 - 75 - 90 ns c l = 15pf 5 - 25 - - - - - ns c l = 50pf 6 - - 51 - 64 - 76 ns a, b, r to qt phl c l = 50pf 2 - - 320 - 400 - 480 ns 4.5 - - 64 - 80 - 96 ns c l = 15pf 5 - 26 - - - - - ns c l = 50pf 6 - - 54 - 68 - 82 ns reset propagation delay t phl ,t plh c l = 50pf 2 - - 215 - 270 - 325 ns r to q or q 4.5 - - 43 - 54 - 65 ns 6 - - 37 - 46 - 55 ns output transition time t thl , t tlh c l = 50pf 2 - - 75 - 95 - 110 ns 4.5 - - 15 - 19 - 22 ns 6 - - 13 - 16 - 19 ns output pulse width r x = 10k ? , c x = 10nf - - 5 - 45 - - - - - s pulse width match between circuits in the same package r x = 10k ? , c x = 10pf --5- 2- - - - - % power dissipation capacitance (note 4) c pd c l = 15pf 5 - - - - - - - pf input capacitance c in c l = 50pf - 10 - 10 - 10 - 10 pf hct types trigger propagation delay a, b, r to q t plh c l = 50pf 4.5 - - 60 - 75 - 90 ns c l = 15pf 5 - 25 - - - - - ns a, b, r to qt phl c l = 50pf 4.5 - - 68 - 85 - 102 ns c l =15pf 5 - 27 - - - - - ns reset propagation delay r to q or q t phl ,t plh c l = 50pf 4.5 - - 48 - 60 - 72 ns output transition time t thl , t tlh c l = 50pf 4.5 - - 15 - 19 - 22 ns output pulse width r x = 10k ? , c x = 10nf - - 5 - 45 - - - - - s cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 7 switching speci?ations input t r , t f = 6ns, r x = 10k ? , c x = 0 (continued) parameter symbol test conditions v cc (v) 25 o c -40 o c to 85 o c -55 o c to 125 o c unit s min typ max min max min max pulse width match between circuits in the same package r x = 10k ? , c x = 10pf --5 2- - - - - % input capacitance c in c l = 50pf - - - 10 - 10 - 10 pf note: 4. c pd is used to determine the dynamic power consumption, per multivibrator. p d = (c pd + c x ) v cc 2 f i (c l v cc 2 f o ) where f i = input frequency f o = output frequency c l = output load capacitance c x = external capacitance v cc = supply voltage, assuming f i i t w - -- --- cd54/74hc123, cd54/74hct123, cd74hc423, cd74hct423 8 test circuits and waveforms figure 1. output pulse control using reset input ( r) pulse for 123 figure 2. output pulse control using reset input ( r) for 423 figure 3. triggering of one shot by input a or input b for a period t w figure 4. typical output pulse width as a function of c x for r x = 10k ? and 100k ? figure 5. typical ??factor as a function of v cc b = low a = high t w t w v s v s q r b a t w t w a b r b = low a = high q t w v s v s t w t w a b b a q t rt ( r = high) t w t w t w t w n ote: output pulse control using retrigger pulse for 123 and 423. v s output pulse width ( s) 2 4 6 8 10 3 10 2 10 1 2 4 6 8 2 4 6 8 2 4 6 8 external capacitance (c x ) - pf 2468 10 3 10 4 2 4 68 2 4 68 2 4 68 10 5 10 6 10 7 r x = 100k ? r x = 10k ? dc supply voltage (v cc ) = 5v ambient temperature (t a ) = 25 o c external capacitance (c x ) = 10nf external resistance (r x ) = 10k ? to 100k ? ambient temperature (t a ) = 25 o c 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 1234 567891011 ??factor hct dc supply voltage (v cc ) - volts packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) 5962-8684701ea active cdip j 16 1 tbd a42 snpb n / a for pkg type 5962-8970001ea active cdip j 16 1 tbd a42 snpb n / a for pkg type cd54hc123f active cdip j 16 1 tbd a42 snpb n / a for pkg type cd54hc123f3a active cdip j 16 1 tbd a42 snpb n / a for pkg type cd54hct123f3a active cdip j 16 1 tbd a42 snpb n / a for pkg type cd74hc123e active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc123ee4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc123m active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123m96 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123m96e4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123m96g4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123me4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123mg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123mt active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123mte4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123mtg4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pw active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwe4 active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwg4 active tssop pw 16 90 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwr active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwre4 active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwrg4 active tssop pw 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwt active tssop pw 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc123pwte4 active tssop pw 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 9-oct-2007 addendum-page 1 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) cd74hc123pwtg4 active tssop pw 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423e active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc423ee4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hc423m active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423m96 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423m96e4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423m96g4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423me4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423mg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423mt active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423mte4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim CD74HC423MTG4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423nsr active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423nsre4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hc423nsrg4 active so ns 16 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123e active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct123ee4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct123m active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123m96 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123m96e4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123m96g4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123me4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123mg4 active soic d 16 40 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123mt active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123mte4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct123mtg4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim package option addendum www.ti.com 9-oct-2007 addendum-page 2 orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ball finish msl peak temp (3) cd74hct423e active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct423ee4 active pdip n 16 25 pb-free (rohs) cu nipdau n / a for pkg type cd74hct423m96 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct423m96e4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct423m96g4 active soic d 16 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct423mt active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct423mte4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim cd74hct423mtg4 active soic d 16 250 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined. pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. package option addendum www.ti.com 9-oct-2007 addendum-page 3 tape and reel information *all dimensions are nominal device package type package drawing pins spq reel diameter (mm) reel width w1 (mm) a0 (mm) b0 (mm) k0 (mm) p1 (mm) w (mm) pin1 quadrant cd74hc123m96 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 cd74hc123nsr so ns 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 q1 cd74hc123pwr tssop pw 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 q1 cd74hc423m96 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 cd74hc423nsr so ns 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 q1 cd74hct123m96 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 cd74hct423m96 soic d 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 q1 package materials information www.ti.com 19-mar-2008 pack materials-page 1 *all dimensions are nominal device package type package drawing pins spq length (mm) width (mm) height (mm) cd74hc123m96 soic d 16 2500 333.2 345.9 28.6 cd74hc123nsr so ns 16 2000 346.0 346.0 33.0 cd74hc123pwr tssop pw 16 2000 346.0 346.0 29.0 cd74hc423m96 soic d 16 2500 333.2 345.9 28.6 cd74hc423nsr so ns 16 2000 346.0 346.0 33.0 cd74hct123m96 soic d 16 2500 333.2 345.9 28.6 cd74hct423m96 soic d 16 2500 333.2 345.9 28.6 package materials information www.ti.com 19-mar-2008 pack materials-page 2 mechanical data mtss001c january 1995 revised february 1999 post office box 655303 ? dallas, texas 75265 pw (r-pdso-g**) plastic small-outline package 14 pins shown 0,65 m 0,10 0,10 0,25 0,50 0,75 0,15 nom gage plane 28 9,80 9,60 24 7,90 7,70 20 16 6,60 6,40 4040064/f 01/97 0,30 6,60 6,20 8 0,19 4,30 4,50 7 0,15 14 a 1 1,20 max 14 5,10 4,90 8 3,10 2,90 a max a min dim pins ** 0,05 4,90 5,10 seating plane 0 8 notes: a. all linear dimensions are in millimeters. b. this drawing is subject to change without notice. c. body dimensions do not include mold flash or protrusion not to exceed 0,15. d. falls within jedec mo-153 important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all products are sold subject to ti?s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with ti?s standard warranty. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. ti assumes no liability for applications assistance or customer product design. customers are responsible for their products and applications using ti components. to minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. ti does not warrant or represent that any license, either express or implied, is granted under any ti patent right, copyright, mask work right, or other ti intellectual property right relating to any combination, machine, or process in which ti products or services are used. information published by ti regarding third-party products or services does not constitute a license from ti to use such products or services or a warranty or endorsement thereof. use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from ti under the patents or other intellectual property of ti. reproduction of ti information in ti data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. reproduction of this information with alteration is an unfair and deceptive business practice. ti is not responsible or liable for such altered documentation. information of third parties may be subject to additional restrictions. resale of ti products or services with statements different from or beyond the parameters stated by ti for that product or service voids all express and any implied warranties for the associated ti product or service and is an unfair and deceptive business practice. ti is not responsible or liable for any such statements. ti products are not authorized for use in safety-critical applications (such as life support) where a failure of the ti product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of ti products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by ti. further, buyers must fully indemnify ti and its representatives against any damages arising out of the use of ti products in such safety-critical applications. ti products are neither designed nor intended for use in military/aerospace applications or environments unless the ti products are specifically designated by ti as military-grade or "enhanced plastic." only products designated by ti as military-grade meet military specifications. buyers acknowledge and agree that any such use of ti products which ti has not designated as military-grade is solely at the buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. ti products are neither designed nor intended for use in automotive applications or environments unless the specific ti products are designated by ti as compliant with iso/ts 16949 requirements. buyers acknowledge and agree that, if they use any non-designated products in automotive applications, ti will not be responsible for any failure to meet such requirements. following are urls where you can obtain information on other texas instruments products and application solutions: products applications amplifiers amplifier.ti.com audio www.ti.com/audio data converters dataconverter.ti.com automotive www.ti.com/automotive dsp dsp.ti.com broadband www.ti.com/broadband clocks and timers www.ti.com/clocks digital control www.ti.com/digitalcontrol interface interface.ti.com medical www.ti.com/medical logic logic.ti.com military www.ti.com/military power mgmt power.ti.com optical networking www.ti.com/opticalnetwork microcontrollers microcontroller.ti.com security www.ti.com/security rfid www.ti-rfid.com telephony www.ti.com/telephony rf/if and zigbee? solutions www.ti.com/lprf video & imaging www.ti.com/video wireless www.ti.com/wireless mailing address: texas instruments, post office box 655303, dallas, texas 75265 copyright ? 2008, texas instruments incorporated |
Price & Availability of CD74HC423MTG4
![]() |
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
[Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |